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In CTESTM, we Combine Talents from different industries to Enhance your career Search. Our Collaborative Teams are Excellent reSearchers who are Committed Towards Exceptional Services.

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Research Engineer (Stationed in Japan)

Our Client, a well established design and manufacturer of advanced abrasive tools and precision machines, is inviting suitable candidates to join their dynamic team.

Job No: 2320      |       Advertised on: 2021-05-12      |       CIC: Christina Tin      |       Reg. No: R1103418
Job Location(s): Others

CTESxTAFEP_recruitment
  JOB DESCRIPTION Our client is actively searching for a Research Engineer to join their team!
If you are a dynamic individual seeking a new career opportunity, read further!

The ideal candidate will need to have the following qualities and experience:
  • Minimum Diploma education
  • Experience in Semiconductor Packaging field (preferably with extensive focus on front end wafer Temporary bonding and debonding process knowledge)
  • Working knowledge in TSI/ TSV / RDL for wafer bumping processes will be advantage
  • Understand materials characterization and analysis technique related to knowledge of Wafer Level Packaging, SOC, W2W, C2W_HB
  • General understanding of Wafer cleaning processes, IC packaging materials, reliability standards
  • Good Project management Skill with Minimum Japanese-speaking/conversational capability

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An exciting career awaits the right candidate! Click "Quick Apply" to register your interest now.

All applicants' CV will be treated with the strictest confidentiality. We regret to inform that only shortlisted candidates will be contacted.
  SALARY Negotiable

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We will try our best to reply all candidates within 7 working days.

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